Concurrent Team Design for Complex PCBsThis webinar features the use of Cadence® Allegro® technology to accelerate the design of complex PCBs using a concurrent team-based approach with multiple designers. Today's printed circuit board (PCB) designers face increasing design challenges from two significant trends. The first is the exponentially increasing complexity of leading-edge board designs. In most cases, today's system designs are constrained by size, which in turn raises the layer count of the PCB. These boards often have multiple large pin-count ASICs and even FPGAs with multiple high-speed interfaces interconnecting them. Increasing functional content in these devices have driven down device size and pin/pad pitches, which in turn has mandated the use of high-density interconnect (HDI) design and manufacturing techniques. The second trend that compounds system design complexity issues is geographically dispersed design teams. Today, it is unusual for a company to have all of its design expertise in the same physical location. More common is for the design team to be dispersed around a campus, a country, or the world. This drives the need for designers to collaborate on design projects not as a serial process, but concurrently in order to manage design schedules and better utilize resources among geographic time zones. Attendees will receive an overview and demonstration of the capabilities, advantages, and benefits of the concurrent team-based PCB implementation technology available as part of Allegro PCB solutions. Who Should Attend
Date/TimeSeptember 23, 2009 - Webinar, at your desktop : 7:00 AM - 8:00 AM PST September 23, 2009 - Webinar, at your desktop : 11:00 AM - 12:00 PM PST (http://timeanddate.com/worldclock/)
Register at http://www.secure-register.net/cadence/allegro_webinars |
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